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CORE & ELECTIVE COURSE DESCRIPTIONS
EE/MT/PEP 507 Introduction to Microelectronics and Photonics
An overview of microelectronics and Photonics science and technology. It provides the student who wishes to be engaged in design, fabrication, integration, and applications in these areas with the necessary knowledge of how the different aspects are interrelated. |
PEP/MT/EE 503 Introduction to Solid State Physics
Description of simple physical models which account for electrical conductivity and thermal properties of solids. It covers basic crystal lattice structure, X-ray diffraction, dispersion curves for phonons and electrons in reciprocal space, energy bands, Fermi surfaces, metals, insulators, semiconductors, superconductivity, and ferromagnetism. |
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PEP/MT/EE 515 Photonics I
Discussions of basic optical systems, laser beam propagation, aberration theory, design and analysis of optical systems, imaging, MTF theory, optical manufacturing and testing, interferometry and spectrophotometry, opto-mechanical engineering, radiometry and radiation detectors. |
PEP/MT/EE 516 Photonics II
Topics covered include: optical thin films and materials production methods, Maxwell'są equations in stratified media, Fresnel equations, polarization, ellipsometry, thin film design and analysis, thin films for fiber optics applications, signal and noise considerations, infrared optical systems. |
PEP/MT/EE 561 Solid State Electronics I
Introduction to fundamentals of semiconductors and basic building blocks of semiconductor devices. Topics covered include description of crystal structures and bonding; introduction to statistical description of electron gas; free-electron theory of metals; motion of electrons in periodic lattices-energy bands; Fermi levels; semiconductors and insulators; electrons and holes in semiconductors; impurity effects; generation and recombination; mobility and other electrical properties of semiconductors; thermal and optical properties; p-n junctions; metal-semiconductor contacts. |
PEP/MT/EE 562 Solid State Electronics II
Introduction to operating principles, modeling, and fabrication of solid state devices for modern electronic and photonic system implementation. Topics covered include charge carrier transport in semiconductors; diffusion and drift, injection and lifetime of carriers. Various state-of-the-art electronic, photonic, and microwave devices and integrated systems will be discussed. |
PEP/MT/EE 595 Reliability and Failure of Solid State Devices
Treatment of the electrical, chemical, environmental, and mechanical driving forces that compromise the integrity and lead to the failure of devices. Both chip and packaging level failures will be modeled and quantified statistically. On the packaging level, thermal stresses, solder creep, fatigue and fracture, contact relaxation, corrosion and environmental degradation will be treated. Additional topics include strategies to enhance reliability, the roles of defects, yield modeling, testing, and failure mode analysis. |
PEP/MT/EE 596 Micro-Fabrication Techniques
Discussions of aspects of the technology of processing procedures involved in the fabrication of microelectronic devices and microelectromechanical systems (MEMS). Topics with respect to IC fabrication include crystal growth, epitaxy, silicon oxide growth, impurity doping, ion implantation, photo and electron beam lithography, etching, sputtering, thin film metallization, passivation and packaging. Students will also learn that MEMS are sensors and actuators that are designed using different areas of engineering disciplines and they are constructed using a microlithographically-based manufacturing process in conjunction with both semiconductor and micromachining microfabrication technologies. |
PEP/MT/EE 626 Optical Communication Systems
Topics covered include components for and design of optical communication systems; propagation of optical signals in single mode and multimode optical fibers; optical sources and photodetectors; optical modulators and multiplexers; optical communication systems: coherent modulators, optical fiber amplifiers and repeaters, transcontinental and transoceanic optical telecommunication system design; optical fiber local area networks. |
PEP/MT/EE 685 Physical Design of Wireless Systems
Introduction to wireless communication systems; the concept of frequency reuse; basic planning of a cellular system, elements of cellular radio design system; propagation characteristics of cellular radio channels; frequency management, channel allocation and handoff mechanisms; specifications of digital cellular systems in USA and Europe; spread spectrum cellular communications; elements of cordless communication systems. |
PEP/MT/CPE 690 Introduction to VLSI Design
Introduction to the principles and design techniques of very large scale integrated circuits (VLSI). Topics include: MOS transistor characteristics, DC analysis, resistance, capacitance models, transient analysis, propagation delay, power dissipation, CMOS logic design, transistor sizing, layout methodologies, clocking schemes, case studies. Students will use VLSI CAD tools for layout, and simulation. |
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